COMPASS - Virtual - November 17 & 18, 2020
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Executive Welcome and Roadmap
Amy Leong, Chief Marketing Officer and Senior Vice President, M&A, General Manager
Amy Leong has served as our Chief Marketing Officer since 2017 with added responsibilities as our Senior Vice President, M&A and General Manager of the Emerging Growth Business Unit since 2020. Prior to FormFactor, Amy held the position of VP of Marketing at MicroProbe from 2010 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Before joining MicroProbe, Amy worked at Gartner, Inc. as a Research Director from 2008 to 2010 and covered the foundry & logic market and various emerging applications. From 2003 to 2008, Amy worked at FormFactor where she served as Senior Director of Corporate Strategic Marketing and Director of DRAM Product Marketing. Prior to FormFactor, she worked in a variety of semiconductor process engineering, metrology, and product marketing roles at KLA and IBM. Amy holds an M.S. in Material Science and Engineering from Stanford University and a B.S. in Chemical Engineering from the University of California, Berkeley.
Keynote: “Heterogeneous Integration - An Advanced Packaging View” (Intel)
The world around us is becoming more and more dependent on data. As Clive Humby, UK Mathematician, puts it “data is the new oil; if unrefined, it cannot really be used”. Processing big data efficiently is heavily dependent on advances in system compute and comms. This presentation will talk about the requirements for advancing system performance including high bandwidth and low power data pipes; and the methods by which ultra-high performance for next generation devices can be achieved through heterogeneous integration on advanced packages. A multitude of multi-chip packaging including 2D, 2.5D, and 3D will be reviewed, including the challenges associated with meeting the needs of next generation HPC devices. This presentation will cover the innovations needed in materials, equipment, process and design as related to package substrate and assembly in advancing the next generation of heterogeneous packaging technologies.
Hamid R. Azimi, Ph.D. Vice President, Technology and Manufacturing Group, Director Substrate Packaging Technology Development, Intel
Dr Hamid Azimi, an Intel VP in Technology Development group, is responsible for advanced substrate packaging for all Intel logic products across substrate suppliers' factories, as well as the company's two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
Keynote: “Probe in the Spotlight – A Key Enabler for Advanced Packaging, Chiplets, and Heterogenous Integration” (FormFactor)
To offset the slowing of front-end-driven Moore’s Law and sustain the innovation trajectory that has fueled fifty-plus years of semiconductor industry growth, the development of advanced packaging is rapidly accelerating. As industry focus moves from front-end fab to post-fab integration, wafer probe is taking a prominent role in enabling a variety of advanced-packaging schemes like heterogenous integration of chiplets. This rise in prominence is being driven by two basic trends, one economic and one technical. On the economic front, surprisingly high pre-assembly chiplet yields are required for viable composite product yields, driving increased test fidelity and coverage. On the technical front, chiplet-to-chiplet interconnect structures are at least an order of magnitude denser than traditional flip-chip interconnect, driving a corresponding intensification in both probe pitch and probe count. As a consequence, advanced packaging is driving more probes, on more probe cards, with more challenging requirements for the wafer test community, pushing us into the spotlight previously occupied by our friends in the fab.
Mike Slessor, Chief Executive Officer, FormFactor Inc.
Michael D. Slessor has served as the Chief Executive Officer of FormFactor, Inc. since December 2014, and as a Director since October 2013. Mike served as President from October 2013 to December 27, 2014, and as Senior Vice President and General Manager, MicroProbe Product Group from October 2012 to October 2013. Before joining FormFactor, he was President and Chief Executive Officer of MicroProbe from July 2008 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Prior to joining MicroProbe, he held various management, product-marketing, and applications-engineering positions in the semiconductor industry, primarily with KLA-Tencor. Mike received his Ph.D. in Aeronautics and Physics from the California Institute of Technology and his B.A.Sc. in Engineering Physics from the University of British Columbia.
“The Advancement of THz Test & Measurement Equipment for 5G, 6G and Beyond” (VDI)
The presentation will focus on recent advances in THz test & measurement equipment, as well as measurement examples using these systems. Advances include compact network and spectrum analyzer extenders to 1.1 THz with state-of-the-art output power and sensitivity, and the capability of generating and detecting wideband modulated signals. The compact size of these systems is key to their use with wafer probing stations, since the close connection reduces loss and improves the power that can be delivered on wafer.
Jeffrey Hesler, CTO & Owner, Virginia Diodes, Inc.
Jeffrey L Hesler is the CTO of Virginia Diodes and a visiting faculty at the University of Virginia. For more than 25 years he has worked to create new technologies that utilize the Terahertz (THz) frequency band for scientific, defense, and industrial applications. He has published over 200 technical papers, is a member of IEEE Technical Committee MTT-21 (THz Technology and Applications) and is a co-Editor of the IEEE Transactions on Terahertz Science and Technology. Terahertz systems based on his innovative designs are now used in hundreds of research laboratories throughout the world.
”Load-pull Probe Station for Characterization of 5G Devices and Circuits at Wafer-Level”
5G mm-Wave technologies comes with substantial enhancements in connectivity, revolutionizing smart cities, the internet of things, vehicle to everything (V2X), and more. One of the fundamental requirements of such 5G devices is to maximize their performance for best-in-class connectivity solutions by optimizing power and/or efficiency of the contained amplifiers and transistors. This is done by measuring the performance characteristics of the device under test at different impedances that are systematically changed using load-pull tuners. FormFactor has partnered up with Focus Microwaves and Keysight Technologies to deliver a fully integrated solution for accurate on-wafer mm-Wave load-pull measurements.
Anthony Lord, Director, RF Segment Business Development, FormFactor Inc.
Anthony Lord is Director, RF Segment Business Development for FormFactor’s Systems Business Unit. Anthony has been involved in many organizational roles within the company, including applications engineering, sales management, product line management, strategic marketing as well as segment marketing, and has been actively involved in the semiconductor and RF industry for 24 years. Anthony has published several papers on RF on-wafer measurements, and has hosted numerous workshops and presentations on on-wafer test applications. Currently, Anthony is exploring where the RF semiconductor market is heading, and how to position future products to enable engineers to make the most accurate measurements with the fastest time to data.
“Next Generation, Fine Pitch HBM Cube Characterization to Production”
In this session, we will review the current generation HBM2E memory cube characterization tests using fine pitch vertical technology and the existing mass production wafer sort capability. Looking forward to next generation HBM3, the bump-to-bump pitch changes to allow for better testability and flexibility to enable production level testing of the memory cube.
Quay Nhin, Senior Product Marketing Manager, FormFactor Inc.
Quay Nhin, MBA, joined FormFactor in 2007 and is currently serving as the Technical Product Marketing Manager for the memory products with the focus on emerging HBM and high speed wafer-level test requirement. Quay had held various engineering positions in Technical Support and Field Applications. His areas of interest are in high frequency, signal integrity and power delivery in advanced packaging technologies.
Prior to joining FormFactor, Nhin was an Application Test Engineer for Advanced Power Devices (ADP) which later acquired by Diode Inc. During the time at ADP, Nhin was responsible for device yield analysis and designing application test circuits for device characterization and datasheet publication.
“Advancing Quantum Computing (and Other Exciting Science) with Low Temperature Probe Stations and milliKelvin Research Cryostats ” (HPD)
The fields of quantum computing and superconducting computing are experiencing tremendous growth, and will likely have profound impacts on various technologies and in our everyday lives. Additionally, the fields of astronomy, astrophysics, and cosmology are vibrant with ongoing research taking place at observatories around the globe.
However, long before these technologies become reality, years of development is required for the many of essential components. Conceptualization, prototyping, and refinement of these superconducting devices can only be performed at cryogenic temperatures. HPD’s 4 K cryogenic probe stations and milliKelvin Adiabatic Demagnetization Refrigerator (ADR) research cryostats serve a vital role in many of these endeavors.
Charlie Danaher, Director, New Business Development, High Precision Devices
Charlie Danaher, an 18-year veteran at HPD, has been in cryogenics since 1999. Working closely with scientists around the world, and with those at the National Institute of Standards and Technology (NIST), in Boulder, CO, Charlie has collaborated in the development of many cryostats. After designing several of HPD’s cryostat products – including HPD’s first ADR cryostat – Charlie moved into Sales, and, for the last decade, has been working closely with customers to help identify, and create, the ideal solution for their research needs. Serving as Vice President of Sales, Charlie has been establishing and nurturing HPD’s international representation network.
“1/f Noise Challenges and Solutions” (Keysight)
As the semiconductor industry rapidly moves forward understanding the value, importance and role of flicker noise in characterizing semiconductor devices; challenges are encountered in accomplishing and interpreting the measurements. Industry is developing smaller devices with lower power consumption and more elaborate semiconductor processes that require a better understanding of the device’s performance as well as the overall circuit system performance.
Noise plays a greater role in these new generation devices, circuits and sophisticated processes. Moreover, measuring and modeling low-frequency noise (LFN) has become critical; as this noise can impair signal processing circuitry in both signal generation and receiver circuitry. A reduction of a factor of 10 in flicker noise would result in a 10 dB improvement in phase noise; assuming flicker noise represents the dominant noise source in the device.
Equally important, 1/f and random telegraph noise (RTN) has been adopted as a metric for reliably predicting process control in semiconductor production. A reduction in LFN equates to an overall improvement in the reliability of the device since LFN is related to traps and gate leakage current. More specifically, LFN characterization is being used as a predictor of a device’s performance and reliability for High Electron Mobility Transistor (HEMT) devices. Empirical research and device physics have demonstrated that a high-quality passivation reduces the effects of surface traps and preserves a low gate leakage current.
Accomplishing 1/f and random telegraph noise (RTN) measurements introduces various challenges. Specifically:
- as the technology shifts to high power devices, such as GaN; 1/f measurement solutions must meet the challenge of accomplishing measurements requiring very high currents at least >1A
- wider bandwidths are often required for a proper characterization of a 1/f measurement
- accomplishing measurements across wider bandwidths in a timely fashion
- 1/f measurement solutions require a better noise floor and corner frequency performance to support the growing number of new generation devices with very low noise as is the case for MOSFET in the linear region
The new Keysight comprehensive LFN measurement solution for device modeling, characterization and reliability testing, E4727B address all challenges identified and more.
Arnaldo (AJ) Sans, Application Engineer, Keysight Technologies Inc.
AJ is an Application Engineer for Keysight’s Foundry Services organization for EEs of in the Americas. Keysight–EEs of Foundry Services provides devices modeling, device characterization measurements and 1/f measurements services for Americas based customers.
Arnaldo J (AJ) joined the Agilent / Keysight Team in 2000, prior to joining Keysight he was an RF Designer working military radar systems at Lockheed Martin. He also developed RF receiver circuits for airborne radar systems at Honeywell Inc.
He holds a BS in Electrical Engineering from The University of Connecticut (UCONN) and a MS in Electrical Engineering from Florida International University (FIU).
“Surface Metrology for Advanced Packaging Applications”
In advanced packaging, even more so than in other semiconductor manufacturing, metrology is an enabler for success. Having many different process steps with complex measuring tasks, a multi sensor tool gives best flexibility and results to run production smooth and effective. Using many optical sensors in one automated recipe and performing hybrid metrology on a single tool gives new opportunities for complex 2.5 D and 3 D devices.
Thomas Fries, CEO FRT GmbH, a FormFactor Company
Thomas Fries founded FRT GmbH in 1995 and has served as CEO since that time. He is involved in the European semiconductor community, serving on the advisory board of IVAM e.V. and Supervisory board of PlanOptik AG. He graduated from University of Bonnwith a Ph.D.
“5G and mmW Applications”
In moving to High Volume Manufacturing (HVM) 5G is presenting numerous new challenges in wafer known good die testing. We will be discuss a few of the considerations that need to be done in high speed RF test, including considerations in tests.
Daniel Bock, RF Applications Engineer, FormFactor Inc.
Daniel Bock got his Ph.D. in Physics at Carnegie Mellon University in 2006, working on Superconducting Nanowire Bolometers in the NanoFabrication Lab. He then went to work in 2007 with Physical Optics Corporation in Torrance, CA. There, he was awarded more than $4M in SBIR research grants from the Department of Defense, developing innovative high power tunable filters for use in Electronics Warfare and Electronics Attack systems. He joined the Cascade Microtech Business Unit in June of 2012. Since joining, he has been working to extend the mmWave bandwidth of Pyramid Probe technology, including RF test of automotive radar devices. He has also led the development of the Custom Calibration Substrate (Custom ISS) product line to supplement the standard ISS line.
VIDEO REQUEST FORM
Keynote: “Heterogeneous Integration - An Advanced Packaging View” (Intel)
The world around us is becoming more and more dependent on data. As Clive Humby, UK Mathematician, puts it “data is the new oil; if unrefined, it cannot really be used”. Processing big data efficiently is heavily dependent on advances in system compute and comms. This presentation will talk about the requirements for advancing system performance including high bandwidth and low power data pipes; and the methods by which ultra-high performance for next generation devices can be achieved through heterogeneous integration on advanced packages. A multitude of multi-chip packaging including 2D, 2.5D, and 3D will be reviewed, including the challenges associated with meeting the needs of next generation HPC devices. This presentation will cover the innovations needed in materials, equipment, process and design as related to package substrate and assembly in advancing the next generation of heterogeneous packaging technologies.
Hamid R. Azimi, Ph.D. Vice President, Technology and Manufacturing Group, Director Substrate Packaging Technology Development, Intel
Dr Hamid Azimi, an Intel VP in Technology Development group, is responsible for advanced substrate packaging for all Intel logic products across substrate suppliers' factories, as well as the company's two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
Keynote: “Probe in the Spotlight – A Key Enabler for Advanced Packaging, Chiplets, and Heterogenous Integration” (FormFactor)
To offset the slowing of front-end-driven Moore’s Law and sustain the innovation trajectory that has fueled fifty-plus years of semiconductor industry growth, the development of advanced packaging is rapidly accelerating. As industry focus moves from front-end fab to post-fab integration, wafer probe is taking a prominent role in enabling a variety of advanced-packaging schemes like heterogenous integration of chiplets. This rise in prominence is being driven by two basic trends, one economic and one technical. On the economic front, surprisingly high pre-assembly chiplet yields are required for viable composite product yields, driving increased test fidelity and coverage. On the technical front, chiplet-to-chiplet interconnect structures are at least an order of magnitude denser than traditional flip-chip interconnect, driving a corresponding intensification in both probe pitch and probe count. As a consequence, advanced packaging is driving more probes, on more probe cards, with more challenging requirements for the wafer test community, pushing us into the spotlight previously occupied by our friends in the fab.
Mike Slessor, Chief Executive Officer, FormFactor Inc.
Michael D. Slessor has served as the Chief Executive Officer of FormFactor, Inc. since December 2014, and as a Director since October 2013. Mike served as President from October 2013 to December 27, 2014, and as Senior Vice President and General Manager, MicroProbe Product Group from October 2012 to October 2013. Before joining FormFactor, he was President and Chief Executive Officer of MicroProbe from July 2008 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Prior to joining MicroProbe, he held various management, product-marketing, and applications-engineering positions in the semiconductor industry, primarily with KLA-Tencor. Mike received his Ph.D. in Aeronautics and Physics from the California Institute of Technology and his B.A.Sc. in Engineering Physics from the University of British Columbia.
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REGISTER EARLY!
The first 100 people to register for COMPASS will be entered to win one of these three great prizes!*
Beats Solo3 Headphones | Nepresso VertuoPlus & Aeroccino3 Milk Frother | Sonos One Speaker w/Voice Control
ATTEND COMPASS!
We will host a drawing after each lightning session at COMPASS and you could win!*
Campark Waterproof Action Camera | JBL Flip 5 Portable Speaker | Fitbit inspire 2 Fitness Watch
BUT WAIT THERE'S MORE...
Just by attending, you will receive these great items!*
- COMPASS Notebook- a conference tradition!
- FormFactor quality writing instrument
- Lunch on us! A $15 gift card to DoorDash or your regional food delivery service
*Must be a FormFactor customer or prospective customer to win. Must be present at COMPASS to win.