COMPASS - Munich, Germany- November 14, 2019

Munich, Germany

COMPASS Munich, Germany

FormFactor’s users’ conference, COMPASS, returns to Munich on November 14th, 2019. At the event, industry leaders and speakers from leading-edge research institutions and FormFactor share test insights on a wide variety of emerging applications, such as 5G, silicon photonics, trends in advanced packages, and millimeter-wave measurement and calibration. In addition to the technical sessions, attendees are invited to this networking opportunity to discuss the products and technologies shaping our future. COMPASS in Munich is held during SEMICON Europa and Productronica week.

Would you like to attend? Register Now!

When: Thursday, November 14th
Where: Hilton Munich Airport
Cost: FREE

COMPASS 2019- Munich Keynote Speaker Announced

Drivers for Advanced Packaging: 2020 and Beyond

The electronics industry has entered a new era of change.  5G is driving advanced packaging developments in infrastructure and mobile handsets.  Electronic content in automotive applications is increasing dramatically.  Automobiles are on the threshold of a radical change in technology and this is driving advanced packaging technology.  The advanced packaging solution for many of these applications involves heterogeneous integration.  This economic solution addresses the end of silicon scaling.   This presentation examines the trends and the impact on the advanced packaging market, with a discussion of the type of packages that can be expected.

E-Jan-Vardaman-testsearch

E. Jan Vardaman, President and Founder, TechSearch International

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE CPMT and is an IEEE CPMT Distinguished Lecturer. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

COMPASS 2019- Munich Preliminary Agenda

08:45 - 09:15   Registration and Networking Breakfast

Registration and pre-event networking

09:15 - 09:25   Welcome and Agenda Overview

09:30 -10:00   Keynote: “Drivers for Advanced Packaging: 2020 and Beyond” (TechSearch International)

Drivers for Advanced Packaging: 2020 and Beyond

The electronics industry has entered a new era of change.  5G is driving advanced packaging developments in infrastructure and mobile handsets.  Electronic content in automotive applications is increasing dramatically.  Automobiles are on the threshold of a radical change in technology and this is driving advanced packaging technology.  The advanced packaging solution for many of these applications involves heterogeneous integration.  This economic solution addresses the end of silicon scaling.   This presentation examines the trends and the impact on the advanced packaging market, with a discussion of the type of packages that can be expected.

E-Jan-Vardaman-testsearch

E. Jan Vardaman, President and Founder, TechSearch International

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE CPMT and is an IEEE CPMT Distinguished Lecturer. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

10:00 - 10:30   Technical Session 1: “Investigating the Effects of Input-output Impedances on Power Amplifiers” (Focus Microwave)

Investigating the Effects of Input-output Impedances on Power Amplifiers  - Vince Mallette, Focus Microwaves

This talk presents the design of efficiency enhanced power amplifiers by concurrently controlling input and output harmonics. In GaN-based PAs, a significant efficiency degradation occurs if the input harmonics are not terminated at optimum condition. The objective of the work is to reveal the impact of input non-linearity on performance and investigate the possible design methodologies to minimize efficiency degradation by simultaneously controlling input and output harmonics. The practical validation and results are shown for GaN using S-Band harmonic system as well as 5G harmonic system optimized for 28GHz with harmonic control at 56GHz on both the load and source, all measurements were performed on a FormFactor Summit200 semi automatic probe station.

10:30 - 11:00   Technical Session 2: “Transferring the Accuracy of Multiline TRL to Industrial Calibrations” (PTB)

Transferring the Accuracy of Multiline TRL to Industrial Calibrations - Uwe Arz, Physikalisch-Technische Bundesanstalt (PTB)

This talk presents the design of efficiency enhanced power amplifiers by concurrently controlling input and output harmonics. In GaN-based PAs, a significant efficiency degradation occurs if the input harmonics are not terminated at optimum condition. The objective of the work is to reveal the impact of input non-linearity on performance and investigate the possible design methodologies to minimize efficiency degradation by simultaneously controlling input and output harmonics. The practical validation and results are shown for GaN using S-Band harmonic system as well as 5G harmonic system optimized for 28GHz with harmonic control at 56GHz on both the load and source, all measurements were performed on a FormFactor Summit200 semi automatic probe station.

11:00 - 11:30   Technical Session 3: “Test Challenges and Solutions for Advanced Packaging” (imec)

Test Challenges and Solutions for Advanced Packaging - Ferenc Fodor, imec

Multi-die stacked ICs are getting increasing traction in the market, fueled by innovations in wafer processing technologies (e.g., vertical inter-die and intra-die connections), stack assembly, and advanced packaging approaches (e.g., wafer-level packaging). Given the nonperfect nature of their manufacturing processes, these stacked ICs (SICs) need all to be individually tested for manufacturing defects in an effective, yet efficient manner. This paper discusses a handful of probing challenges specific to such SICs and their solutions: probing ultra-thin wafers on a flexible tape on extra-large tape frames, probing on large arrays of dense micro-bumps, analyzing probe-to-pad alignment (PTPA) accuracy contributions from probe station and probe card on the basis of probe mark images, and efficient auto-correction of individual misalignments of singulated dies or die stacks on tape. The paper includes a real-life case study, in which most of the discussed challenges and solutions are combined.

11:30 - 12:00   Technical Session 4: “Multi Sensor Metrology Tools for Hybrid Metrology in Wafer Manufacturing” (FRT GmbH)

Multi Sensor Metrology Tools for Hybrid Metrology in Wafer Manufacturing” (FRT GmbH)

Abstract pending

12:00 - 13:00   Business Break and Lunch

13:00 - 13:30   Technical Session 5: “Benefits of Reduced Insertion Loss for mmWave Over Temperature Wafer Test” (FormFactor)

Benefits of Reduced Insertion Loss for mmWave Over Temperature Wafer Test - Gavin Fisher, FormFactor

The frequency of on wafer RF test has increased rapidly in the last few years, and several customers need to do this over a wide temperature range. FormFactor has provided banded thermal mmw solutions for several years. However, most have been required electrically and physically long waveguide extensions for the probe to enter the MicroChamber measurement enclosure. The chamber is required to keep the probing environment dry and dark at low temperatures as well as providing EMI shielding.

At lower frequencies the losses involved with an extended guide can be acceptable although not  optimized. However, at elevated bands like WR3, these losses are more problematical. In part, the  extended approach has historically been due to the large size of the frequency extender. Virginia Diodes Inc (VDI) have a range of compact extenders. We wished to capitalize on their small size and excellent performance and create an optimized solution with minimal additional losses.

In this talk we will show our new reduced loss solution on the CM300 wafer prober using WR3 Mini extenders and compare the performance with the extended path solutions we have used historically. Key benchmarks are the improvement in measurement drift, raw directivity and dynamic range. With the revised approach it’s possible to make better measurements for longer without recalibration. We will show the reduction in path insertion loss also. The revised approach also enables us to use our new compact programmable positioners for automatic MLTRL calibrations with WinCal XE™.

13:30 - 14:00   Technical Session 6: “High Parallelism Testing of Advanced Image Sensors” (STMicroelectronics)

High Parallelism Testing of Advanced Image Sensors - Guillaume GIRARD, STMicroelectronics

Abstract pending

14:15 - 14:30   Break

14:15 - 14:45   Technical Session 7: “Silicon Photonics Testing” (imec/FormFactor)

Silicon Photonics Testing - Mario Berg, FormFactor

A fully automatic system for wafer-level testing of photonic devices is presented. The test system is deployed for optical process control monitor (PCM) characterization to support the ongoing development of a silicon photonics technology platform. Optical measurements are performed using two single mode optical fiber pigtails that are actively aligned to on-wafer fiber grating couplers. The fiber pigtails are complemented with electrical probes for the electro-optical characterization of active photonic devices such as modulators and photodiodes.

An extensive library of custom made Python software tools has been written. This library includes the code for test execution as well as the algorithms for automatic analysis of raw test data, device parameter extraction and reporting. The calculated device parameters are validated against target specs and tabulated in HTML reports. This automatic analysis and reporting work flow results in fast feedback from testing to process integration and allows to efficiently track the influence of process conditions on device performance metrics. The measurement tool operates in a clean-room environment. This opens up the possibility of performing measurements before processing is complete, leading again to faster feedback to integration engineers. Potential processing issues can thus be flagged at an earlier stage – avoiding extra delays and cost associated with undesired process drift. A system of witness wafers is implemented to contain the risk of tool contamination. Metal contamination of the measurement chuck is monitored by performing TXRF inspection on the back side of witness wafers while particle measurements are performed both on front and back side.

14:45 - 14:50   Closing

14:50 - 16:00   Networking Reception

COMPASS 2019- Munich Registration

When: Thursday, November 14th
Where: Hilton Munich Airport
Cost: FREE

COMPASS 2019 - Munich

Contact Information

Special Requests

Registration Terms

Portions of COMPASS may be audio or video recorded, photographed, published and/or archived. By checking the box below, you grant FormFactor permission to use video recordings, audio recordings and photographs of you for FormFactor publications and marketing materials.

Terms Agreement *