Georg Franz, CTO, T.I.P.S. Messtechnik

Georg received a master's degree in mechanical engineering at the Technical University in Vienna, Austria. Then he started as R&D engineer at Carinthian Tech Research, where he developed and designed wafer handling equipment and micro-manufacturing machines. Another field of work was the development of semiconductor and MEMS sensors, where he did finite element analysis for applied basic research. After a three-year interlude as FEM expert in the wind industry, he returned to the semiconductor industry. In 2012 he joined T.I.P.S. as a technical manager. T.I.P.S. manufactures test interfaces focused on automotive and power semiconductors, as well as sensors and MEMS. His main responsibility is process and product development.

High-voltage, High-power Testing in Engineering and Production - A Survey

"Power" devices require high voltages and high currents in wafer testing with the risk of unwanted discharges. A simple and effective method to suppress arcing is testing under higher than atmospheric pressure. This method is realized by using a chip-scale pressure chamber integrated into the probe card, pressurized by compressed air.

In this presentation the basic scheme of the electrical test of power devices is explained as well as the physics behind arcing. Then the whole range of probe cards with chip-scale pressure chambers are presented. Specific designs which contact the wafer cover the test requirements for engineering and chip development.

The standard range of non-contact pressure chambers are for production wafer test. Recent technological advances extend the application to even higher test temperatures. This requires the use of hot compressed air in the chamber, and such a probe card with tailored compressed air heating device is also presented.