COMPASS - Munich, Germany- November 14, 2019

Munich, Germany

COMPASS Munich, Germany

FormFactor’s users’ conference, COMPASS, returns to Munich on November 14th, 2019. At the event, industry leaders and speakers from leading-edge research institutions and FormFactor share test insights on a wide variety of emerging applications, such as 5G, silicon photonics, trends in advanced packages, and millimeter-wave measurement and calibration. In addition to the technical sessions, attendees are invited to this networking opportunity to discuss the products and technologies shaping our future. COMPASS in Munich is held during SEMICON Europa and Productronica week.

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When: Thursday, November 14th
Where: Hilton Munich Airport
Cost: FREE

COMPASS 2019- Munich Keynote Speaker Announced

Drivers for Advanced Packaging: 2020 and Beyond

The electronics industry has entered a new era of change.  5G is driving advanced packaging developments in infrastructure and mobile handsets.  Electronic content in automotive applications is increasing dramatically.  Automobiles are on the threshold of a radical change in technology and this is driving advanced packaging technology.  The advanced packaging solution for many of these applications involves heterogeneous integration.  This economic solution addresses the end of silicon scaling.   This presentation examines the trends and the impact on the advanced packaging market, with a discussion of the type of packages that can be expected.

E-Jan-Vardaman-testsearch

E. Jan Vardaman, President and Founder, TechSearch Internationalr

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE CPMT and is an IEEE CPMT Distinguished Lecturer. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

COMPASS 2019- Munich Preliminary Agenda

08:45 - 09:15   Registration and Networking Breakfast

Registration and pre-event networking

09:15 - 09:25   Welcome and Agenda Overview

09:30 -10:00   Keynote: “Drivers for Advanced Packaging: 2020 and Beyond” (TechSearch International)

Drivers for Advanced Packaging: 2020 and Beyond

The electronics industry has entered a new era of change.  5G is driving advanced packaging developments in infrastructure and mobile handsets.  Electronic content in automotive applications is increasing dramatically.  Automobiles are on the threshold of a radical change in technology and this is driving advanced packaging technology.  The advanced packaging solution for many of these applications involves heterogeneous integration.  This economic solution addresses the end of silicon scaling.   This presentation examines the trends and the impact on the advanced packaging market, with a discussion of the type of packages that can be expected.

E-Jan-Vardaman-testsearch

E. Jan Vardaman, President and Founder, TechSearch Internationalr

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE CPMT and is an IEEE CPMT Distinguished Lecturer. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

10:00 - 10:30   Technical Session 1: “Load pull measurements for 5G” (Focus Microwave)

10:30 - 11:10   Technical Session 2: “Transferring the accuracy of multiline TRL to industrial calibrations” (PTB)

11:00 - 11:30   Technical Session 3: “Test Challenges and Solutions for Advanced Packaging” (imec)

11:45 - 13:10   Business Break and Lunch

13:15 - 13:45   Technical Session 4: “Benefits of Reduced Insertion Loss for mmWave Over Temperature Wafer Test” (FormFactor)

13:45 - 14:15   Technical Session 5: “LED Wafer Probe Test/ VCSEL Testing”

14:15 - 14:30   Break

14:30 - 15:00   Technical Session 6: “Silicon Photonics Testing” (imec/FormFactor)

15:00 - 15:15   Closing

15:15 - 16:30   Networking Reception

COMPASS 2019- Munich Registration

When: Thursday, November 14th
Where: Hilton Munich Airport
Cost: FREE

COMPASS 2019 - Munich

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