Robert Polster, Post-Doctoral Researcher, Columbia University

Robert Polster received his Ph.D. from the Universite Paris Sud in 2015 for his research on silicon photonic links that was carried out at the CEA-LETI in Grenoble, France. He received his M.S. in Physics from the Humboldt University, Berlin, Germany in 2012. His master’s thesis was carried out at the Institute for Quantum Optics and Quantum Information Theory (IQOQI) in Vienna from 2011-2012. He carried out further studies at the Paul-Scherrer-Institut / ETH Zurich and in the high field laser laboratory of the Max-Born-Institute in Berlin from 2006-2009. He is currently leading AIM Photonics functional testing program. His team’s responsibilities are the standardization of supported test geometries, the design of test structures and the general bootstrapping efforts for AIM Photonics testing facility.

Test Challenges in AIM Photonics Multi-Project Wafer Offering

Since the beginning of 2017, the American Institute for Manufacturing Integrated Photonics (AIM Photonics) is offering multi-project wafer runs, giving small businesses access to silicon photonics. In the beginning of 2018, AIM Photonics will add a wafer-scale high-speed testing service for the fabricated photonic ICs (PICs) as well as 2.5D assemblies. To make this testing service possible, design for test ideas and standards were defined and will be presented. The set of standards range from alignment aids to test structures allowing the verification of the PICs and assemblies. AIM is currently developing a wafer-scale edge-coupling technique granting direct access to the device under test using planar lightwave circuits (PLCs). Wafer-scale edge coupling makes taps to grating coupler redundant, hence leads to major improvements in the power budget and the component density of the PIC. Optical IO density is usually defined by the fiber cladding diameter which is 127 μm for a single mode fiber. Using glass based PLCs as an intermediary between fiber and PIC the pitch between couplers can be as small as 20 μm on the PIC. First measurement results, designs and next steps will be presented